A SIMPLE KEY FOR MONOCRYSTALLINE SILICON UNVEILED

Wire-observed wafer slicing is probably the key creation systems for industrial crystalline silicon PV cells, and improvements in wafer slicing technological know-how have resulted in a reduction in raw wafer thickness from 370 μm to 180 μm since 1997 for Sharp industrial polycrystalline-silicon cells (Figure 6). To introduce wafers thinner than